Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D.
| Autor: | Ida, Y., Garrou, P.E., Strandjord, A.J.G., Cummings, S.L., Boyd Rogers, W., Berry, M.J., Kisting, S.R. |
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| Zdroj: | Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium; 1995, p441-444, 4p |
| Databáze: | Complementary Index |
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