Optical in situ monitoring of silicon diaphragm thickness during wet etching.
| Autor: | Minami, K., Tosaka, H., Esashi, M. |
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| Zdroj: | Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines & Robotic Systems; 1994, p217-222, 6p |
| Databáze: | Complementary Index |
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