Full copper wiring in a sub-0.25 /spl mu/m CMOS ULSI technology.

Autor: Edelstein, D., Heidenreich, J., Goldblatt, R., Cote, W., Uzoh, C., Lustig, N., Roper, P., McDevitt, T., Motsiff, W., Simon, A., Dukovic, J., Wachnik, R., Rathore, H., Schulz, R., Su, L., Luce, S., Slattery, J.
Zdroj: International Electron Devices Meeting IEDM Technical Digest; 1997, p773-776, 4p
Databáze: Complementary Index