Solder pastes tackiness: the influences of the process atmosphere and of the test method.
| Autor: | Guillaume, B., Guinet, J., Hubert, J.-C. |
|---|---|
| Zdroj: | 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium; 1990, p375-384, 10p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|