Parylene encapsulation of ceramic packages for liquid nitrogen application.
| Autor: | Tong, H.M., Mok, L., Grebe, K.R., Yeh, H.L., Srivastava, K.K., Coffin, J.T. |
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| Zdroj: | 40th Conference Proceedings on Electronic Components & Technology; 1990, p345-345, 1p |
| Databáze: | Complementary Index |
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