AC electromigration characterization and modeling of multilayered interconnects.
| Autor: | Ting, L.M., May, J.S., Hunter, W.R., McPherson, J.W. |
|---|---|
| Zdroj: | 31st Annual Proceedings Reliability Physics 1993; 1993, p311-316, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|