Reliability study of the laminate-based flip-chip chip scale package.
| Autor: | Matsuda, Y., Takai, T., Okada, Y., Lall, P., Koehler, C., Tessier, T., Olsen, D. |
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| Zdroj: | 2nd 1998 IEMT/IMC Symposium (IEEE Cat No98EX225); 1998, p40-44, 5p |
| Databáze: | Complementary Index |
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