The Role of Thermal Grooving, Thermotransport and Electrotransport on the Failure of Thin Film Metallizations.
Autor: | Hummel, R.E., Goho, S. Matts, DeHoff, R. T. |
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Zdroj: | 22nd International Reliability Physics Symposium; 1984, p234-241, 8p |
Databáze: | Complementary Index |
Externí odkaz: |