The Role of Thermal Grooving, Thermotransport and Electrotransport on the Failure of Thin Film Metallizations.

Autor: Hummel, R.E., Goho, S. Matts, DeHoff, R. T.
Zdroj: 22nd International Reliability Physics Symposium; 1984, p234-241, 8p
Databáze: Complementary Index