Solder metallization interdiffusion in microelectronic interconnects.
| Autor: | Zribi, A., Chromik, R.R., Presthus, R., Clum, J., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J. |
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| Zdroj: | 1999 Proceedings 49th Electronic Components & Technology Conference (Cat No99CH36299); 1999, p451-457, 7p |
| Databáze: | Complementary Index |
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