Flip-Chip Modules for Millimeter-Wave Sensor Applications.
| Autor: | Kerssenbrock, T. v., Tischer, H., Siweris, H.J., Bogner, W., Schmelz, C., Meier, T., Kellner, W., Heide, P. |
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| Zdroj: | 1998 28th European Microwave Conference; 1998, Issue 1, p601-606, 6p |
| Databáze: | Complementary Index |
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