3D packaging solutions for a silicon micropump.
| Autor: | Kelly, G., Alderman, J., Lyden, C., Barrett, J., Morrissey, B.A., Val, A., Sbiaa, Z., Camon, H. |
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| Zdroj: | 1997 Proceedings 47th Electronic Components & Technology Conference; 1997, p1227-1234, 8p |
| Databáze: | Complementary Index |
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