Polymer tapered waveguides and flip-chip solder bonding as compatible technologies for efficient OEIC coupling.
| Autor: | Goodwill, D.J., Fan, R.S., Hooker, R.B., Yung-Cheng Lee, McComas, B.L., Mickelson, A.R., Morozova, N.D., Tomic, D. |
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| Zdroj: | 1997 Proceedings 47th Electronic Components & Technology Conference; 1997, p788-796, 9p |
| Databáze: | Complementary Index |
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