Device degradation due to stud bumping above the MOSFET region and the effect of annealing on the degradation.

Autor: Shimoyama, N., Machida, K., Shimaya, M., Akiya, H., Kyuragi, H.
Zdroj: 1997 IEEE International Reliability Physics Symposium Proceedings 35th Annual; 1997, p118-123, 6p
Databáze: Complementary Index