Self-aligned, fluxless flip-chip bonding technology for photonic devices.
| Autor: | Kuhmann, J.F., Hensel, H.-J., Pech, D., Harde, P., Bach, H.-G. |
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| Zdroj: | 1996 Proceedings 46th Electronic Components & Technology Conference; 1996, p1088-1092, 5p |
| Databáze: | Complementary Index |
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