Advances in flip-chip underfill flow and cure rates and their enhancement of manufacturing processes and component reliability.
| Autor: | Daqing Max Shi, Carbin, J.W. |
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| Zdroj: | 1996 Proceedings 46th Electronic Components & Technology Conference; 1996, p1025-1031, 7p |
| Databáze: | Complementary Index |
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