Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures.
| Autor: | Shih, D.-Y., Yeh, H., Narayan, C., Lewis, J., Graham, W., Nunes, S., Paraszczak, J., McGouey, R., Galligan, E., Cataldo, J., Serino, R., Perfecto, E., Chang, C.-A., Deutsch, A., Rothman, L., Ritsko, J., Wilczynski, J. |
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| Zdroj: | 1992 Proceedings 42nd Electronic Components & Technology Conference; 1992, p1002-1014, 13p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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