A novel application of polyimide-W-Al/Cu for VLSI interconnect.
| Autor: | Joshi, R.V., Hsu, L., Dalal, H., Klymco, P., Jaso, M., Ng, H. |
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| Zdroj: | 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference; 1991, p75-81, 7p |
| Databáze: | Complementary Index |
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