Via processing options for MCM-D fabrication: excimer laser ablation vs. reactive ion etching.
| Autor: | Tessier, T.G., Hoffman, W.F., Stafford, J.W. |
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| Zdroj: | 1991 Proceedings 41st Electronic Components & Technology Conference; 1991, p827-834, 8p |
| Databáze: | Complementary Index |
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