Reverse pillar and maskless contact-two novel recessed metal schemes and their comparisons to conventional VLSI metallization schemes.
Autor: | Yeh, J.L., Hills, G.W., Cochran, W.T. |
---|---|
Zdroj: | 1988 Proceedings, Fifth International IEEE VLSI Multilevel Interconnection Conference; 1988, p95-100, 6p |
Databáze: | Complementary Index |
Externí odkaz: |