Submicron wiring technology with tungsten and planarization.
| Autor: | Kaanta, C., Cote, W., Cronin, J., Holland, K., Lee, P.-I., Wright, T. |
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| Zdroj: | 1988 Proceedings, Fifth International IEEE VLSI Multilevel Interconnection Conference; 1988, p21-28, 8p |
| Databáze: | Complementary Index |
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