Non-destructive open fault isolation in flip-chip devices with space-domain reflectometry.
| Autor: | Qiu, W., Tan, S.C., Tay, M.Y., Gaudestad, J., Talanov, V.V., Wei, M.S. |
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| Zdroj: | Proceedings of the 20th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA); 2013, p332-336, 5p |
| Databáze: | Complementary Index |
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