Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design.
| Autor: | Vianello, E., Thomas, O., Harrand, M., Onkaraiah, S., Cabout, T., Traore, B., Diokh, T., Oucheikh, H., Perniola, L., Molas, G., Blaise, P., Nodin, J. F., Jalaguier, E., De Salvo, B. |
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| Zdroj: | Proceedings of 2013 International Conference on IC Design & Technology (ICICDT); 2013, p235-238, 4p |
| Databáze: | Complementary Index |
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