Fabrication of 3D-IC interposers.
Autor: | Keech, John, Chaparala, Satish, Shorey, Aric, Piech, Garrett, Pollard, Scott |
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Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1829-1833, 5p |
Databáze: | Complementary Index |
Externí odkaz: |