Single chip plated Ni/Pd over ALCAP bond pads for flip chip applications and prototyping.
| Autor: | Lewis, Brian J., Baldwin, Daniel F., Houston, Paul N., Xie, Fei, La, Le Hang |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1564-1568, 5p |
| Databáze: | Complementary Index |
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