Microstructure investigation of TSV copper film.
| Autor: | Putra, W. N., Li, H. Y., Trigg, A. D., Gan, C. L. |
|---|---|
| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1414-1419, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|
| Autor: | Putra, W. N., Li, H. Y., Trigg, A. D., Gan, C. L. |
|---|---|
| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1414-1419, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|