A lead-frame pre-mold coreless substrate development.
| Autor: | Lan, Chang-Yi Albert, Hsiao, C S, Tsai, Jensen, Chen, Eason, Hung, Otis |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1336-1340, 5p |
| Databáze: | Complementary Index |
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