The new primer with copper foil corresponding to semi-additive process for package substrates.
| Autor: | Onozeki, Hitoshi, Inoue, Tsubasa, Yamagishi, Katsuji, Tanabe, Takahiro, Suzuki, Takayuki, Ikeda, Kenichi, Ogawa, Nobuyuki |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1320-1324, 5p |
| Databáze: | Complementary Index |
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