Mechanism of low-temperature copper-to-copper direct bonding for 3D TSV package interconnection.
| Autor: | Cho, J., Yu, S., Roma, M. P. C., Maganty, S., Park, S., Bersch, E., Kim, C., Sapp, B. |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1133-1140, 8p |
| Databáze: | Complementary Index |
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