Key elements for sub-50μm pitch micro bump processes.
| Autor: | De Vos, J., Bogaerts, L., Buisson, T., Gerets, C., Jamieson, G., Vandersmissen, K., Manna, A. La, Beyne, E. |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1122-1126, 5p |
| Databáze: | Complementary Index |
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