Low cost, high performance, and high reliability 2.5D silicon interposer.
| Autor: | Sundaram, Venky, Chen, Qiao, Wang, Tao, Lu, Hao, Suzuki, Yuya, Smet, Vanessa, Kobayashi, Makoto, Pulugurtha, Raj, Tummala, Rao |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p342-347, 6p |
| Databáze: | Complementary Index |
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