High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias.
| Autor: | Phommahaxay, Alain, De Wolf, Ingrid, Hoffrogge, Peter, Brand, Sebastian, Czurratis, Peter, Philipsen, Harold, Civale, Yann, Vandersmissen, Kevin, Halder, Sandip, Beyer, Gerald, Swinnen, Bart, Miller, Andy, Beyne, Eric |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p227-231, 5p |
| Databáze: | Complementary Index |
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