Analyzing the behavior and shear strength of common adhesives used in temporary wafer bonding.
| Autor: | Sharpe, J. A., Jordan, M. B., Burkett, S. L., Barkey, M. E. |
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| Zdroj: | 2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p94-100, 7p |
| Databáze: | Complementary Index |
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