| Autor: |
Chaturvedi, Sandeep, Sai Saravanan, G., Bhat, Mahadeva K., Bhalke, Sangam, Badnikar, S. L., Muralidharan, R., Koul, Shiban K. |
| Předmět: |
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| Zdroj: |
IETE Journal of Research; May/Jun2013, Vol. 59 Issue 3, p201-209, 9p |
| Abstrakt: |
Packaging of Micro-Electro-Mechanical system (MEMS) at wafer-level is one of the critical areas for its application, as the MEMS elements are delicate and can easily get damaged during wafer scribing or packaging process. We describe here a novel approach for wafer-level encapsulation of GaAs-based RFMEMS switches. EM simulation of the proposed microcaps has been carried out to study the effect of encapsulation on the switch performance. Both GaAs and Pyrex glass-based caps have been fabricated and the switches were encapsulated. The performance of the packaged switches has been characterized and the measured results show a close agreement with EM simulation. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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