HKMG process impact on N, P BTI: Role of thermal IL scaling, IL/HK integration and post HK nitridation.
| Autor: | Joshi, K., Hung, S., Mukhopadhyay, S., Chaudhary, V., Nanaware, N., Rajamohnan, B., Sato, T., Bevan, M., Wei, A., Noori, A., Mc.Dougal, B., Ni, C., Saheli, G., Lazik, C., Liu, P., Chu, D., Date, L., Datta, S., Brand, A., Swenberg, J |
|---|---|
| Zdroj: | 2013 IEEE International Reliability Physics Symposium (IRPS); 2013, p4C.2-4C.2-4C.2.10, 0p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|