Development of TSV interposer with 300 mm wafer for 3D packaging.
| Autor: | Yoshimi, Seiichi, Fujimoto, Koji, Akazawa, Mivuki, Matsumoto, Hidenobu, Mawatari, Hiroshi, Suzuki, Kousuke, Itoh, Toshihiro, Maeda, Ryutaro |
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| Zdroj: | 2013 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP); 2013, p1-5, 5p |
| Databáze: | Complementary Index |
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