Multi-physics simulation of the component attachment within embedding process.
| Autor: | Macurova, Katerina, Kharicha, Abdellah, Pletz, Martin, Mataln, Marianne, Bermejo, Raul, Schongrundner, Ronald, Krivec, Thomas, Antretter, Thomas, Maia, Wilson, Morianz, Mike, Brizoux, Michel |
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| Zdroj: | 2013 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2013, p1-6, 6p |
| Databáze: | Complementary Index |
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