Thermal design guidelines for a three-dimensional (3D) chip stack, including cooling solutions.
| Autor: | Matsumoto, Keiji, Ibaraki, Soichiro, Sueoka, Kuniaki, Sakuma, Katsuyuki, Kikuchi, Hidekazu, Orii, Yasumitsu, Yamada, Fumiaki, Fujihara, Kohei, Takamatsu, Junichi, Kondo, Koji |
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| Zdroj: | 29th IEEE Semiconductor Thermal Measurement & Management Symposium; 2013, p1-6, 6p |
| Databáze: | Complementary Index |
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