Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate.
| Autor: | Toriyama, Kazushige, Takeoka, Yasushi, Okamoto, Keishi, Noma, Hirokazu, Orii, Yasumitsu |
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| Zdroj: | 2012 2nd IEEE CPMT Symposium Japan; 2012, p1-4, 4p |
| Databáze: | Complementary Index |
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