High reliability encapsulant liquid resin for SIP.
| Autor: | Yukimaru, Joji., Nagai, Koichiro., Ishikawa, Yuki., Okuno, Atsushi. |
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| Zdroj: | 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT); 2012, p1-4, 4p |
| Databáze: | Complementary Index |
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