| Autor: |
Jandeleit, J., Urbasch, G., Hoffmann, H. D., Treusch, H.-G., Kreutz, E. W. |
| Předmět: |
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| Zdroj: |
Applied Physics A: Materials Science & Processing; 1996, Vol. 63 Issue 2, p117, 5p |
| Abstrakt: |
The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated to F[sub thres] = 172 mJ/cm². The ablation rate per pulse is measured as a function of intensity in the range of 5 × 10[sup 9] to 2 × 10[sup 11] W/cm² and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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