| Autor: |
Zheng, Boyu, Cubillo, Joseph Romen, Katti, Guruprasad, Jin, Cheng, Rajoo, Ranjan, Chan, Kai Chong |
| Zdroj: |
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p401-406, 6p |
| Abstrakt: |
Quad flat no-lead (QFN) packages have found wide applications in RF and high-speed digital systems. The purpose of this paper is to study high-frequency performance of conventional low-cost QFN packages, and the impact of various parameters. Physical insight of the bond wires and leadframe are presented through full-wave simulation study. Critical parameters are identified and their effects are evaluated at frequencies up to 20 GHz. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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