Mechanical Characteristics of In and Pb5Sn Solders in a Thinfilm Multichip Package.

Autor: Darveaux, Robert, Yung, Edward, Turlik, Iwona, Murty, K.L.
Zdroj: MRS Online Proceedings Library; 01/24/1990, Vol. 203, pN.PAG-1, 1p
Databáze: Complementary Index
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