Metallization Behavior in Aluminum Nitride Electronic Packages.

Autor: Luh, Ellice Y., Dolhert, Leonard E., Enloe, Jack H., Lau, John W.
Zdroj: MRS Online Proceedings Library; 01/24/1990, Vol. 203, pN.PAG-1, 1p
Databáze: Complementary Index
Externí odkaz: