| Autor: |
Yu, Peng, Fan, Zerui, Yao, Xiaohu |
| Zdroj: |
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging; 1/ 1/2012, p1180-1184, 5p |
| Abstrakt: |
The dropping for Portable electronic produce may cause solder joint failure of packages by our miss handling, which leads to malfunction of product. Therefore, the investigation of response of PCB assembly during dropping is very important to the development or improvement of the product. According to JEDEC standard, in this paper, the response of PCB assembly with five POP packages will be studied in detail by experimental and Finite Element Methods (FEM). The dynamic strain response at some key points of PCB will be tested in drop test, and verified the simulation model. The simulation of PCB assembly is performed by the large commercial finite element software ABAQUS and the stress responses of solder joints during dropping are obtained in the simulation. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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