| Autor: |
Pilard, R., Titz, D., Gianesello, F., Calascibetta, P., Riviere, J.M., Lopez, J., Coffy, R., Saugier, E., Poulain, A., Ferrero, F., Luxey, C., Brachat, P., Jacquemod, G., Gloria, Daniel |
| Zdroj: |
Proceedings of the 2012 IEEE International Symposium on Antennas & Propagation; 1/ 1/2012, p1-2, 2p |
| Abstrakt: |
During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. So far, HTCC technology has been seen as the chosen one when targeting millimeter wave (MMW) applications. But since 60 GHz applications are targeting large volume consumer applications, the pressure on the cost of the packaging will become higher and it is highly desirable to explore alternative lower cost solutions than HTCC. In this paper, we present 60GHz integrated antennas in an innovative low cost High Density Interconnect (HDI) organic technology demonstrating promising high-gain antenna solution (> 7 dBi). [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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