| Autor: |
Kuypers, J. H., Zolfagharkhani, G., Gaidarzhy, A., Thalmayr, F., Sparks, A., Chen, D. M., Rebel, R., Newman, B., Asmani, M., Badillo, D., Schoepf, K. J. |
| Zdroj: |
2012 IEEE International Frequency Control Symposium Proceedings; 1/ 1/2012, p1-5, 5p |
| Abstrakt: |
This invited paper presents the first chip-scale packaged MEMS oscillator solution that meets the stringent requirements for cellular applications. The temperature compensated MEMS oscillator (TCMO™) meets the frequency stability requirement of ±2.5 ppm from −30°C to +85°C, phase noise of −130 dBc/Hz at 1 kHz for a 13 MHz carrier, start-up time of below 2.5 ms and current consumption of less than 5 mA. With dimensions of 1.44×1.04×0.55 mm3 the MEMS oscillator requires less than half the volume of the smallest 2016 TCXO. Importantly, due to the hermetic chip-scale package it can be integrated with larger ICs and SAW/BAW components into larger overmolded modules. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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