| Autor: |
Chua, Tiffany, Babikian, Sarkis, Wu, Liang, Li, G.-P., Bachman, Mark |
| Zdroj: |
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1605-1612, 8p |
| Abstrakt: |
Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm2. Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a “package-on-package” construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
