| Autor: |
Wojnowski, M., Wagner, C., Lachner, R., Bock, J., Sommer, G., Pressel, K. |
| Zdroj: |
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1027-1032, 6p |
| Abstrakt: |
We present for the first time a fully operational 77-GHz silicon-germanium (SiGe) single-chip four-channel transceiver module with four integrated antennas assembled in an embedded wafer-level ball grid array (eWLB) package. This eWLB module has a size of 8 mm × 8 mm and a footprint with a standard ball pitch of 0.5 mm. The module includes four half-wave dipole antennas that are realized using the thin-film redistribution layer (RDL) of the eWLB. The antennas are connected to the transceiver chip using 100-Ω differential coplanar strip (CPS) lines realized in the RDL. The ground plane on top of the printed circuit board (PCB) is used as a reflector for the integrated antenna. Due to integration of the antenna in the package, all mm-wave signals are restricted to the package and no mm-wave transitions to the PCB are required. Moreover, the position of the reflector on the top metallization of the PCB is of great advantage, as it makes the integrated antenna unconstrained by the actual PCB material. Thus, the module can be assembled on any type of PCB. We show that using four radiating elements, it is possible to realize radar system with basic 2D beamforming capabilities. The presented results demonstrate the importance of coherent chip-package co-design and the excellent potential of the eWLB for mm-wave system-in-package (SiP) applications. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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