| Autor: |
Niklaus, Frank, Lapisa, Martin, Bleiker, Simon J., Dubois, Valentin, Roxhed, Niclas, Fischer, Andreas C., Forsberg, Fredrik, Stemme, Goran, Grogg, Daniel, Despont, Michel |
| Zdroj: |
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration; 1/ 1/2012, p247-252, 6p |
| Abstrakt: |
In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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