| Autor: |
Sabri, Mohd Faizul Mohd, Shnawah, Dhafer Abdul-Ameer, Badruddin, Irfan Anjum, Said, Suhana Binti Mohd |
| Zdroj: |
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE); 1/ 1/2012, p453-457, 5p |
| Abstrakt: |
The effects of 0.5 wt.% Fe addition on the microstructural and mechanical properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy were investigated. The addition of Fe leads to the formation of large FeSn2 intermetallic compound (IMC) particles located in the eutectic regions besides the small Ag3Sn and Cu6Sn5 IMC particles. The addition of Fe also leads to enlarge the primary β-Sn grains and diminish the eutectic regions. The formation of large FeSn2 IMC particles together with the presence of large primary β-Sn grains leads to significantly lower elastic modulus and yield strength values for Fe-bearing SAC105 solder alloy. Moreover, the presence of large primary β-Sn grains causes the Fe-bearing solder alloy to maintain the total elongation at the level of SAC105 solder alloy. This effect can increase the bulk compliance and plastic energy dissipation ability of the solder joint, which play an important role in drop impact performance enhancement. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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